Thermal Management:
Easy and economic
Combinable thermal transfer pastes for screen printing
- flexible layouts and layer thicknesses on unassembled PCBs
- cost-effective alternative to conventional heatsinks
- high breakdown voltage heatsink paste for optimum heat transfer and heat spreading
- dielectric strength ≥ 70 kV/mm (DC)
- meets best flame class V-0 according to UL 94 (UL Recognised Component)
- elastic thermal interface paste for perfect connection to metallic cooling elements
