Thermal Management: Easy and ergonomic
Combinable thermal transfer pastes for screen printing
- flexible layouts and layer thicknesses on unassembled PCBs
- excellent moisture and insulation resistance (SIR) at 1000 V
- cost-effective alternative to conventional heatsinks
- high breakdown voltage heatsink paste for optimum heat transfer and heat spreading
- elastic thermal interface paste for perfect connection to metallic cooling elements
