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Inkjet-based PCB design for smart manufacturing
— the s.mask initiative

New PCB designs with inkjet printing

The companies Lackwerke Peters GmbH & Co. KG and Würth Elektronik GmbH & Co. KG have set a milestone in the digitalisation of solder masks by successfully developing the inkjet solder resist Elpejet IJ 2467 and s.mask 3D printing.

In the s.mask initiative, the two PCB manufacturers Würth Elektronik GmbH & Co. KG and STARTEAM Global Germany GmbH are now cooperating with Lackwerke Peters GmbH & Co. KG, a supplier of coating materials for electronics, to launch this technology on the market.

For many years, Würth Elektronik has been manufacturing technologically demanding series products that are reliably used, e.g. in the commercial vehicle industry. Würth Elektronik has acquired extensive knowledge and experience in product design and the entire manufacturing process of three-dimensional solder masks.

www.we-online.com/s-mask

In their Italian plant, STARTEAM has successfully switched over from conventional solder resist coating to digital inkjet printing, when manufacturing prototypes, sample orders and small series.

www.starteam.global

Peters supplies sophisticated inkjet solder resists and legend inks for this purpose.

peters.de/elpejet-ij-2467

All three companies are working together trustfully and purposefully in view of raising awareness of this innovative digital coating technology and establish it on the market.

Innovative printing strategies open up completely new possibilities in PCB design – particularly through the development of new solder resist structures. These 3D structures and optimised material properties take new developments to a new technical level. Compared to conventional standard PCB manufacturing, they offer not only functional advantages but also significant progress in terms of CO2 reduction. Less materials consumption and less energy-intensive process steps contribute to sustainably reducing the environmental impact.

We are convinced that this digital inkjet printing technology will prevail. See for yourself – meet our experts and learn more about the details, interesting solutions and spectacular design options:

  • at productronica in Munich from Nov 18 – 21, 2025, stand B.3.343
  • by attending the presentation „Inkjet-based PCB design for smart manufacturing“ on Wednesday Nov 19, 2025 from 3 p.m. to 3:30 p.m., PCB & EMS-Forum of ZVEI at productronica in Munich, hall B.3
  • at the special event of s.mask initiative on  Tuesday, Dec 9, 2025, 11 a.m. to 4 p.m. hosted by ZVEI, Amelia-Mary-Earhart-Str. 12, 60549 Frankfurt/Main (airport). Click here to register free of charge until Dec 1, 2025:

Features

Appearance

Standard semi-mat appearance. Gloss optional depending on print strategies and curing parameters. Cured by UV-LEDs (365 or 395 nm).

3D Design

Selective solder mask build-up only in the desired places up to 1500 µm without affecting the rest of the solder mask.

Edge coverage of traces

The edge coverage of traces can be adjusted. With high copper thickness, only the edges of the traces require additional ink. 3D Design

Selective minimal design

Inkjet printing is an additive process.  Compared to conventional solder resist  processes, various process steps can be omitted. Special selective minimal design can save up to 80% of the ink.

UUID / lasermarking

Each PCB can be uniquely assigned with a UUID (Universally Unique Identifier). This offers the advantage of traceability over the entire life cycle. So laser marking is no longer necessary.

Printed on an industrial scale inkjet printer:

Surface finishes Hot-Air Levelling (HAL)
Immersion Tin (IMT)
electroless Ni/Au (ENiG)

Registration

for the s.mask initiative special event on:

Tuesday, December 9, 2025, 11:00 to 16:00

Hosted by ZVEI, Amelia-Mary-Earhart-Str. 12, 60549 Frankfurt am Main (Airport).

Inquiry