ELPEPCB® printed circuit coatings​

The complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness

Elpemer® photoresists

Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution

SD 2054

  • Etch and plating resist
  • Application by screen printing
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

Thermal curing etch and plating resists

High-definition application by screen printing

SD 2052 AL

  • Etch resist
  • Resistant to pH 9
  • Alkaline-strippable
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2149 SIT-HS

  • Plating resist for use in Secondary Imaging Technology (SIT), protects metal surfaces during electroless Ni/Au process (ENiG), thus enabling an additional OSP surface finish
  • Good adhesion to copper and solder resists
  • Alkaline strippable
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2154 E

  • Elastic etch and plating resist also suitable for air drying
  • Outstanding resistance over the whole pH range, also in cyanidic baths
  • Solvent-strippable
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

UV curing etch and plating resists

High-definition application by screen printing, alkaline-strippable

SD 2050 UV

  • Etch and plating resist, resistant to pH 9
  • Capable of representing 150 µm structures
  • Suitable to etch 400 μm thick copper
  • Recommended auxiliary products: Anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315

Photoimageable Elpemer® solder resists

Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution

Editions 733 and 766

  • For all standard application processes, aqueous-alkaline developable
  • fulfil latest highly demanding automotive requirements
  • high permanent temperature / thermal shock resistance
  • for temperature critical high current applications
  • excellent moisture and insulation resistance (SIR) at 1000 V
  • halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • for classical contact exposure: Edition 733
  • finest structures due to direct imaging (DI): Edition 766
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

2467 series

  • For all standard application processes, aqueous-alkaline developable
  • Halogen-free adjustments in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

2491 TSW series

  • For all standard application processes, aqueous-alkaline developable
  • Very resistant to yellowing, even after lead-free reflow soldering processes and high thermal load
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

SD 2463 FLEX-HF series

  • Application by screen printing, for printing on flexible base materials, aqueous-alkaline developable
  • Excellent resolution down to 30 μm
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Fulfil/exceed IPC-SM-840E
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

2469 SM-HF series

  • For all standard application processes, extremely wide processing window, developable in carbitol or butyl carbitol
  • Outstanding thermo-mechanical properties with respect to thermal cycling resistance and permanent/high-temperature resistance
  • Fulfil/exceed amongst others IPC-SM-840E, resistant to mould and noxious gases
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21 Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817

Thermal curing solder resists

High-definition application by screen printing, UL approvals in acc. with UL File No. E80315

SD 2446 / SD 2496 TSW

  • Very good weathering and chalking resistance (QUV accelerated weathering test)
  • Excellent colour resistance, even after lead-free reflow soldering and tempering processes, low ΔE values
  • SD 2496 TSW: High reflectivity and exceptional yellowing resistance
  • Halogen-free in acc. with JPCA-ES01-2003/IEC 61249-2-21
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2462 NB / SD 2462 NB-M series

  • Excellent definition and superior conductor edge (knee) coverage
  • SD 2462 NB-M is especially suitable as a “top coat” for thick copper technology (e.g. 400 µm technology, see also thick film fillers)
  • Excellent chemical resistance
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

UV curing solder resists

High-definition application by screen printing, for “print and etch”, UL approvals in acc. with UL File No. E80315

SD 2368 UV series

  • Cure thoroughly even in thicker layers
  • Suitable for Hot-Air Levelling
  • Recommended auxiliary products: Anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2460/201 UV-FLEX-HF series

  • Resistant to HAL and lead-free reflow soldering
  • For flexible circuits, excellent adhesion to polyimide, polycarbonate and polyester foils
  • For cross-over technology as well as organic and printed electronics
  • Halogen-free in acc. with JPCA-ES01-2003 and IEC 61249-2-21
  • Recommended auxiliary products: Anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process

SD 2950 series

  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • For printing over carbon-conductive ink
  • Peelable from plated-through holes
  • Suitable as masks in electroplating and other metallisation processes
  • Unlimited pot/processing life, solvent-free
  • Recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable Solder Masks of the series PSM 13.990
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

SD 2361 series

  • 100% solids content means virtually no volume shrinkage
  • 1-pack system
  • Thixotropic adjustment for larger drill holes (approx. 0.5-1 mm)
  • Recommended auxiliary products: Anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

Elpemer® VF 2467 DG

  • Photoimageable plugging paste
  • Basically compatible with Elpemer® 2467 solder resist series
  • Aqueous-alkaline developable
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

SD 2768 NB

  • High solids content means low volume shrinkage
  • For via-in-pad applications, no bleeding on gold or other metal surfaces
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

Elpemer® VF 2469 SM-HF

  • Photoimageable
  • Basically compatible with the Elpemer® 2469 SM-HF solder resist series
  • Developable in carbitol or butyl carbitol
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, special stripper HP 5710, cleaning agents R 5899, R 5821 and R 5817

Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

PP 2795 series

  • Application by screen and stencil printing, vacuum plugging and roller coating
  • Higher aspect ratios possible with high-viscosity adjustment
  • Listed in NASA specification D-8202
  • Long shelf life: 6 months
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

Exceptional covering power, very good adhesion, soldering resistant, high solids content

Photoimageable Elpemer® marking inks

Blanket application by screen printing, especially suitable for pilot and low-volume series’ as no complex screen stencil required, capable of representing finest details

SD 2691 TSW

  • Aqueous-alkaline developable
  • Outstanding yellowing resistance even after reflow soldering and tempering processes, low ΔE values
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

SD 2618 / SD 2698

  • Aqueous-alkaline developable
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817, defoamant HP 5911

Thermal curing marking inks

High-definition application by screen printing

SD 2696 TSW

  • Excellent yellowing resistance after lead-free reflow soldering and tempering processes, low ΔE values
  • High reflectivity
  • Very good weathering and chalking resistance (QUV accelerated weathering test)
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2692 T series

  • Long pot/processing life: at least 6 weeks
  • Catalysed adjustments cure faster, pot life 1 day
  • Superior chemical resistance
  • Recommended auxiliary products: Screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

SD 2617 series

  • Long pot/processing life: at least 1 month
  • Recommended auxiliary products: Universal thinner UV 5000, screen opener HP 5200, anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

UV curing marking inks

High-definition application by screen printing

SD 2593 UV

  • Solids content 100%
  • Short curing times
  • High colour stability
  • Recommended auxiliary products: Anti-static spray HP 5500, cleaning agents R 5899, R 5821 and R 5817

to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors

SD 2842 HAL

  • Ultra-smooth surface, thus also suitable for sliding contacts
  • Recommended auxiliary products: Screen opener HP 5200, cleaning agents R 5899, R 5821 and R 5817

SD 2843 HAL

  • For touch-key contacts
  • Individual resistances possible by mixing with insulating paste SD 2803 HAL
  • Recommended auxiliary products: Screen opener HP 5200, cleaning agents R 5899, R 5821 and R 5817

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating

Heatsink pastes

for heat transfer and heat dissipation

HSP 4 A

  • better chemical resistance than HSP 2741
  • smoother surface enables good thermal connection in combination with TIP 2792
  • UL recognized component, UL File No. E80315
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817

Thermal interface paste

applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings

TIP 2792

  • elastic, thus enabling a reliable thermal connection
  • for thermo-mechanical decoupling
  • recommended auxiliary product: Cleaning agent R 5817

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ELPEPCB® Printed Circuit Coatings​

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