Go beyond borders!
ELPEPCB® via filler PP 2794 TG150/TG170: Reliable and economical
- For via hole filling
- Easy vacuum application
- Excellent grindability and metallisability
- High glass transition temperature Tg of 150 °C or 170 °C
- Low coefficient of thermal expansion
- Low coefficient of thermal expansion
- for PP 2794 TG150: α₁ 23 ppm/°C, α₂ 72 ppm/°C
- for PP 2794 TG170: α₁ 18 ppm/°C, α₂ 58 ppm/°C
